Pb-free solder alloy
US9199339B2 · kind B2 · utility
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Key dates
| Filing date | Jun 15, 2011 |
| Grant date | Dec 1, 2015 |
| Priority date | — |
| Expiry date | Jun 15, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3463
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
Disclosed herein is a high-temperature Pb-free solder alloy having the strength required to join electronic parts to a substrate and having excellence in wettability and workability. The high-temperature Pb-free solder alloy contains 0.4% by mass or more but 13.5% by mass or less of Zn, 0.05% by mass or more but 2.0% by mass or less of Cu, 0.500% by mass or less of P, and a balance being Bi except for inevitable impurities. The Pb-free solder alloy may further contain 0.03% by mass or more but 0.7% by mass or less of Al.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.