Thermally shorted bolometer
US9199838B2 · kind B2 · utility
2Cited by
17References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 2, 2014 |
| Grant date | Dec 1, 2015 |
| Priority date | — |
| Expiry date | Oct 2, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4913
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
In one embodiment, A MEMS sensor assembly includes a substrate, a first sensor supported by the substrate and including a first absorber spaced apart from the substrate, and a second sensor supported by the substrate and including (i) a second absorber spaced apart from the substrate, and (ii) at least one thermal shorting portion integrally formed with the second absorber and extending downwardly from the second absorber to the substrate thereby thermally shorting the second absorber to the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.