Method for depositing a thin film, and resulting material
US9199874B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 4, 2010 |
| Grant date | Dec 1, 2015 |
| Priority date | — |
| Expiry date | Feb 7, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24364
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A method of obtaining a substrate coated on a first face with at least one transparent and electrically conductive thin layer based on at least one oxide, including depositing the at least one thin layer on the substrate and subjecting the at least one thin layer to a heat treatment in which the at least one layer is irradiated with aid of radiation having a wavelength between 500 and 2000 nm and focused on a zone of the at least one layer, at least one dimension of which does not exceed 10 cm. The radiation is delivered by at least one radiation device facing the at least one layer, a relative displacement being created between the radiation device and the substrate to treat the desired surface, the heat treatment being such that resistivity of the at least one layer is reduced during the treatment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.