Apparatus for treating thin film and method of treating thin film
US9200369B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 23, 2005 |
| Grant date | Dec 1, 2015 |
| Priority date | — |
| Expiry date | Nov 5, 2026 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/047
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An apparatus and method for treating a thin film on a substrate is presented. The substrate is loaded on a fixed stage adapted to receive the substrate. An energy source is aligned through a space in a gas shield so as to face a thin film on the substrate to be repaired after the substrate is loaded. A protective insulating layer is removed by radiation from the energy source, a reaction gas is supplied to the space, and an open and/or short circuit in the thin film is repaired. The energy source and/or gas shield is moved during the repair, rather than the stage. If the energy source and gas shield are both moved, they are moved in opposite directions, either independently or dependent on each other, by first and second operating units, respectively.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.