Plate
US9200854B2 · kind B2 · utility
0Cited by
13References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 3, 2013 |
| Grant date | Dec 1, 2015 |
| Priority date | — |
| Expiry date | Feb 14, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
The present disclosure relates to a plate for use with a heatsink. The plate is adapted to engage with the heatsink and a fan subassembly, and comprises a first substantially planar section which is adapted to engage with the heatsink and a second substantially planar section which is adapted to engage with the fan subassembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.