Infrared cut filter and imaging apparatus
US9201181B2 · kind B2 · utility
1Cited by
2References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 22, 2013 |
| Grant date | Dec 1, 2015 |
| Priority date | — |
| Expiry date | Sep 13, 2033 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B5/208
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An infrared cut filter includes: a transparent dielectric substrate; an infrared reflecting layer formed on one surface of the transparent dielectric substrate and configured to reflect infrared light; and an infrared absorbing layer formed on the other surface of the transparent dielectric substrate and configured to absorb infrared light. The infrared absorbing layer is formed of a resin that contains infrared absorbing pigment. The infrared reflecting layer is formed of a dielectric multilayer film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.