Hybrid chuck
US9202729B2 · kind B2 · utility
1Cited by
9References
12Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 17, 2006 |
| Grant date | Dec 1, 2015 |
| Priority date | — |
| Expiry date | Mar 9, 2031 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28D15/00
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Device and method for regulating the temperature of a substrate, in particular of a wafer, by means of a device comprising two temperature-regulating circuits that are operated with different temperature-regulating fluids.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.