Light-emitting device package and method for manufacturing the same
US9203000B2 · kind B2 · utility
0Cited by
0References
12Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 12, 2014 |
| Grant date | Dec 1, 2015 |
| Priority date | — |
| Expiry date | Mar 12, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/036
Abstract
A light-emitting device package is disclosed. The light-emitting device package includes a metal substrate. An insulating layer is on the metal substrate, wherein the insulating layer has at least one opening to expose the metal substrate. At least one light-emitting device is disposed in the at least one opening of the insulating layer. A sidewall of the at least one opening of the insulating layer is covered by an optical spacer. The disclosure also provides a method for manufacturing the light-emitting device package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.