LED module for modified lamps and modified LED lamp
US9203001B2 · kind B2 · utility
0Cited by
0References
16Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 26, 2010 |
| Grant date | Dec 1, 2015 |
| Priority date | — |
| Expiry date | Apr 15, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An LED module includes a printed circuit board (PCB) or a surface mount device (SMD) mount, an LED chip mounted on the PCB or the SMD mount, a cover mounted on the LED chip and a surface of the PCB or the SMD mount which surrounds the LED chip. The surface of the PCB or the SMD mount on which the spherical cover is mounted may be covered on its side walls with a white reflective material which is in contact with the LED chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.