Multi-chip modules having stacked television demodulators
US9204080B2 · kind B2 · utility
0Cited by
30References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 6, 2014 |
| Grant date | Dec 1, 2015 |
| Priority date | — |
| Expiry date | Aug 6, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2225/0651
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Systems and methods are disclosed for MCM (multiple chip module) packages having multiple stacked demodulator dies that share one or more MCM pins. The shared pins can include clock generation pins, clock input/output pins, receive signal path input pins, voltage supply pins, ground supply pins, and/or any other desired pins. In addition to reducing footprint sizes for printed circuit board (PCB) applications, the multi-demodulator MCM package embodiments described herein also allow for improved routing of connection traces on PCBs.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.