Patent · US Active

Copper salts of ion exchange materials for use in the treatment and prevention of infections

US9205109B2 · kind B2 · utility

0Cited by
3References
6Claims
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Key dates

Filing dateJan 22, 2013
Grant dateDec 8, 2015
Priority date
Expiry dateJun 3, 2033

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY02P20/582
  • WIPO fieldPharmaceuticals
  • WIPO sectorChemistry

Abstract

Copper salts of ion exchange materials provide copper ions at levels suitable for use as an anti-infective agent. The copper salts of ion exchange materials may be formed using ether and ester derivatives of cellulose, such as carboxymethyl cellulose (CMC), ethylcellulose (EC), methylcellulose (MC), hydroxypropyl cellulose (HPC), hydroxypropyl methyl cellulose (HPMC), hydroxyethyl methyl cellulose (HEMC), cellulose acetate, and cellulose triacetate. Wound dressings having copper salts of ion exchange materials incorporated therein are also provided, and may be used to reduce the incidence of infection in wounds. The wound dressings may also be used to prevent infections in long-term wounds, such as those formed at wound drain, catheter, and ostomy entry sites. Copper salts of ion exchange materials may be used to kill microorganisms, and may optionally be used with additional anti-infective agents.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.