Patent · US Active

High thermal conductivity shell molds

US9205484B2 · kind B2 · utility

0Cited by

12References

15Claims

0Family size

Assignee

General Electric Company · US

Inventors

Qi Zhao · Chongqing, CN
Stephen Francis Rutkowski · Duanesburg, US
Francis Johnson · Minneapolis, US
Wanming Zhang · Clifton Park, US
Min Zou · Fayetteville, US

Key dates

Filing date	Nov 27, 2013
Grant date	Dec 8, 2015
Priority date	—
Expiry date	Jun 5, 2034

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB22C9/04
WIPO fieldMaterials, metallurgy
WIPO sectorChemistry

Abstract

A shell mold is described. The shell mold includes a facecoat, a sealcoat, and a support disposed in between the facecoat and the sealcoat. The support includes a stucco in a concentration greater than about 40 volume percent of the support. The stucco includes a material that has a thermal conductivity greater than about 285 W/m-K.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.