Localized cleaning process and apparatus therefor
US9205509B2 · kind B2 · utility
0Cited by
2References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 28, 2012 |
| Grant date | Dec 8, 2015 |
| Priority date | — |
| Expiry date | Jun 3, 2034 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF05D2230/72
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Methods and apparatuses by which an oxidized metallic surface can be prepared for a subsequent repair operation without excessive removal of parent metal material. At least one gas is supplied to a limited portion of a metallic surface of a component, and the limited portion is locally heated in the presence of the gas to a treatment temperature sufficient to cause the gas or a gas that forms therefrom to chemically remove oxides from the limited portion of the metallic surface. At least a second portion of the metallic surface is not locally heated to the treatment temperature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.