Patent · US Revoked

Full perimeter chemical strengthening of substrates

US9207787B2 · kind B2 · utility

0Cited by
29References
18Claims
0Family size

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Inventors

Key dates

Filing dateSep 17, 2010
Grant dateDec 8, 2015
Priority date
Expiry dateFeb 5, 2032

Classification

  • Technology area (CPC —)General

Abstract

Methods and apparatus for protecting the thin films during chemical and/or thermal edge strengthening treatment. In one embodiment, a portion of each individual sheet is laminated. Pairs of sheets are then sealed together such that the thin film sides face inward to form a thin film sandwich. In some embodiments, the sandwich in then immersed in a chemical strengthener. In other embodiments, a localized treatment is applied to the unstrengthened edges.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.