Quad flat no-lead (QFN) packaging structure and method for manufacturing the same
US9209115B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 24, 2014 |
| Grant date | Dec 8, 2015 |
| Priority date | — |
| Expiry date | Apr 24, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A quad flat no-lead (QFN) packaging structure. The QFN packaging structure includes a metal substrate, a first outer die pad formed on the metal substrate, and a first die coupled to a top surface of the first outer die pad. The QFN packaging structure also includes a plurality of I/O pads formed on the metal substrate, and a first metal layer containing a plurality of inner leads corresponding to the plurality of I/O pads and extending to proximity of the die. The first metal layer is formed on the metal substrate by a multi-layer electrical plating process such that a lead pitch of the plurality of inner leads is significantly reduced. Further, the QFN packaging structure includes metal wires connecting die and the plurality of inner leads, and a second metal layer formed on a back surface of the plurality of I/O pads and the die pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.