No-exposed-pad quad flat no-lead (QFN) packaging structure and method for manufacturing the same
US9209117B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 28, 2014 |
| Grant date | Dec 8, 2015 |
| Priority date | — |
| Expiry date | May 28, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A quad flat no-lead (QFN) packaging structure. The QFN packaging structure includes a metal substrate, a first die coupled to a top surface of the metal substrate, and a plurality of I/O pads formed on the metal substrate, and extending to the proximity of the die. The no-exposed-pad QFN packaging structure also includes a first metal layer containing a plurality of inner leads corresponding to the plurality of I/O pads and extending to proximity of the die and is formed on the metal substrate by a multi-layer electrical plating process. Further, the no-exposed-pad QFN packaging structure includes metal wires connecting the die and the plurality of inner leads, and a second metal layer formed on a back surface of the plurality of I/O pads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.