Optoelectronic device packaging method and chip assembly having an isolation dielectric located on both sides of a high-frequency transmission line to form a coplanar waveguide transmission line
US9210802B2 · kind B2 · utility
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10Claims
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Key dates
| Filing date | Dec 30, 2013 |
| Grant date | Dec 8, 2015 |
| Priority date | — |
| Expiry date | May 9, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10121
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An optoelectronic device includes a packaged part and a core component. The core component includes a chip subcarrier and an optoelectronic chip. The device also includes a connecting plate that forms a coplanar waveguide transmission line together with the ground through a high-frequency transmission line and an isolation dielectric. The coplanar waveguide transmission line and a low-frequency line are connected to the packaged part and the core component and are configured to transmit a high-frequency signal and a low-frequency signal between the packaged part and the core component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.