Copper alloy foil, flexible printed circuit board using the same, and method for producing copper alloy foil
US9210805B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Sep 13, 2010 |
| Grant date | Dec 8, 2015 |
| Priority date | — |
| Expiry date | Oct 30, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0355
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
The zirconium content of the alloy composition of a copper alloy foil of the present invention is 3.0 to 7.0 atomic percent, and the copper alloy foil includes copper matrix phases and composite phases composed of copper-zirconium compound phases and copper phases. As shown in FIG. 1, the copper matrix phases and the composite phases form a matrix phase-composite phase layered structure and are arranged alternately parallel to a rolling direction as viewed in a cross-section perpendicular to the width direction. In addition, the copper-zirconium compound phases and the copper phases in the composite phases form a composite phase inner layered structure and are arranged alternately parallel to the rolling direction at a phase pitch of 50 nm or less as viewed in the above cross-section. This double layered structure presumably makes the copper alloy foil densely layered to provide a strengthening mechanism similar to multilayer reinforced composite materials.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.