Patent · US Active

Device for cutting a structure including wire-like nanoscale objects, and related method

US9211610B2 · kind B2 · utility

0Cited by

3References

13Claims

0Family size

Assignee

COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES · FR

Inventors

Pascal Boulanger · Hameau des Atres, FR
Olivier Sublemontier · Fontenay-aux-Roses, FR
Olivier Gobert · Gallardon, FR

Key dates

Filing date	Dec 14, 2011
Grant date	Dec 15, 2015
Priority date	—
Expiry date	Oct 23, 2032

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB23K2103/50
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

A device for cutting a structure including nanotubes, including: a mechanism to polarize linearly laser pulses emitted in a direction of the structure, wherein a duration of the laser pulses is roughly between 1 femtosecond and 300 femtoseconds; and a mechanism to focus the linearly polarized laser pulses on the structure.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.