Receiving system
US9211668B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 9, 2007 |
| Grant date | Dec 15, 2015 |
| Priority date | — |
| Expiry date | Aug 8, 2031 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29K2105/253
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A system and method for post-treatment of a hollow body molding produced in an injection molding mold. A receiving finger is provided with a first end and a second end. The receiving finger is designed that it can engage into the hollow body molding. The outside shape of the receiving finger substantially corresponds to inside shape of the hollow body molding so that the receiving finger (5) can hold the hollow body molding. Preferably, the outside diameter of the receiving finger is substantially equal to inside diameter of the hollow body molding in a cooled condition so that the hollow body molding can be removed from the receiving finger even after shrinkage. Desirably, the outside diameter of the receiving finger is between about 0.01 mm and about 1 mm and preferably about 0.1 to about 0.5 mm smaller than the inside diameter of the hollow body preform in the removal condition so that the hollow body molding can be removed from the receiving finger even after shrinkage. An apparatus is desirably provided for at least one of cooling and heating the hollow body molding so that the hollow body molding can be selectively cooled or heated by means of the system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.