Method for molding thermoplastic resin product and molding apparatus therefor
US9211672B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 8, 2014 |
| Grant date | Dec 15, 2015 |
| Priority date | — |
| Expiry date | Jan 8, 2034 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C2059/023
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
An apparatus for molding a thermoplastic resin product includes a heating apparatus which conducts heating by radiation of infrared rays by using a light source; a stamper which is radiation heated by infrared rays radiated from the light source; a cooling member which cools the stamper by contacting the stamper which is radiation heated; a first mold which holds the stamper and/or the cooling member in a movable manner, thereby enabling the stamper and the cooling member to be in contact with or remote from with each other; and a second mold which holds a thermoplastic resin to which a structure of a shape-forming surface of the stamper is transferred. The stamper is radiation heated at least in the state where it is remote from the cooling member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.