Substrate processing method and substrate processing apparatus
US9213242B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 3, 2012 |
| Grant date | Dec 15, 2015 |
| Priority date | — |
| Expiry date | Feb 23, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
According to one embodiment, a substrate processing method is disclosed. The method can include treating a substrate with a first liquid. The substrate has a structural body formed on a major surface of the substrate. The method can include forming a support member supporting the structural body by bringing a second liquid into contact with the substrate wetted by the first liquid, and changing at least a portion of the second liquid into a solid by carrying out at least one of causing the second liquid to react, reducing a quantity of a solvent included in the second liquid, and causing at least a portion of a substance dissolved in the second liquid to be separated. The method can include removing the support member by changing at least a part of the support member from a solid phase to a gaseous phase, without passing through a liquid phase.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.