Cooling system for electronic components

US9213378B2 · kind B2 · utility

Assignee

• International Business Machines Corporation · US

Inventors

• William J. Anderl · Rochester, US
• Evan G. Colgan · Chestnut Ridge, US
• James D. Gerken · Zumbro Falls, US
• Christopher M. Marroquin · Rochester, US
• Shurong Tian · Mount Kisco, US

Key dates

• Filing date: Mar 1, 2013
• Grant date: Dec 15, 2015
• Expiry date: Nov 5, 2033

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/0002
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Embodiments of the present invention provide for non interruptive fluid cooling of an electronic enclosure. One or more electronic component packages may be removable from a circuit card having a fluid flow system. When installed, the electronic component packages are coincident to and in a thermal relationship with the fluid flow system. If a particular electronic component package becomes non-functional, it may be removed from the electronic enclosure without affecting either the fluid flow system or other neighboring electronic component packages.