Patent · US Active

Apparatus and method for the thermal treatment of substrates

US9214367B2 · kind B2 · utility

1Cited by
1References
16Claims
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Assignee

Inventors

Key dates

Filing dateDec 16, 2011
Grant dateDec 15, 2015
Priority date
Expiry dateJan 10, 2032

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY02E10/50
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

The application describes an apparatus and a method for the thermal treatment of substrates, in particular thin film substrates for photovoltaic applications. The apparatus comprises at least one substrate carrier for supporting a substrate, a heating unit having at least one heating element for heating a substrate located on the substrate carrier and at least one heating element carrier for supporting the at least one heating element. The heating element carrier is designed to allow a local change in distance between the substrate carrier and the heating element, so as to be able to provide locally different heating intensities. In the method such a change in distance is carried out during the thermal treatment.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.