Apparatus and method for the thermal treatment of substrates
US9214367B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 16, 2011 |
| Grant date | Dec 15, 2015 |
| Priority date | — |
| Expiry date | Jan 10, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The application describes an apparatus and a method for the thermal treatment of substrates, in particular thin film substrates for photovoltaic applications. The apparatus comprises at least one substrate carrier for supporting a substrate, a heating unit having at least one heating element for heating a substrate located on the substrate carrier and at least one heating element carrier for supporting the at least one heating element. The heating element carrier is designed to allow a local change in distance between the substrate carrier and the heating element, so as to be able to provide locally different heating intensities. In the method such a change in distance is carried out during the thermal treatment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.