Patent · US Active

Package method

US9214437B1 · kind B1 · utility

6Cited by
1References
9Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJul 17, 2014
Grant dateDec 15, 2015
Priority date—
Expiry dateJul 17, 2034

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L2924/19106
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

A package method comprises the steps of: providing a metal carrier having a first surface and a second surface opposite to the first surface; forming a first wiring layer on the second surface of the metal carrier; forming a first conductive pillar layer on the first wiring layer; forming a dielectric material layer covering the first wiring layer, the first conductive pillar layer and the second surface of the metal carrier; exposing one end of the first conductive pillar layer; forming a second wiring layer on the exposed end of the first conductive pillar layer; forming a solder resist layer on the dielectric material layer and the second wiring layer; removing the metal carrier.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.