Via structure for transmitting differential signals
US9215795B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 7, 2012 |
| Grant date | Dec 15, 2015 |
| Priority date | — |
| Expiry date | May 15, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/4015
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electrical system including (1) a printed circuit board including first and second signal pads located on a top surface of the printed circuit board and arranged to transmit a first differential signal, first and second signal vias extending through the printed circuit board and arranged to transmit the first differential signal, a first signal trace located on the top surface of the printed circuit board and connecting the first signal pad and the first signal via, and a second signal trace located on the top surface of the printed circuit board and connecting the second signal pad and the second signal via; and (2) a connector including first and second signal contacts arranged to transmit the first differential signal. The first differential signal transmitted through the printed circuit board and the connector has a common central axis.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.