Small form factor stacked electrical passive devices that reduce the distance to the ground plane
US9215807B2 · kind B2 · utility
1Cited by
7References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 25, 2012 |
| Grant date | Dec 15, 2015 |
| Priority date | — |
| Expiry date | Aug 10, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49133
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The described embodiments relate generally to electronic components and more specifically to a capacitor array that can increase component density on a printed circuit board and reduce a distance to a ground plane. An array of capacitors can be formed by coupling a group of capacitors on their sides interspersed with interposer boards. The resulting configuration can increase component density and reduce an amount of resistance and effective series inductance between a set of power decoupling capacitors and an integrated circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.