Methods of forming dual microstructure components
US9216453B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 20, 2009 |
| Grant date | Dec 22, 2015 |
| Priority date | — |
| Expiry date | Jul 2, 2031 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF05D2220/31
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
Methods of forming dual microstructure components include consolidating a powder material comprising an alloy to form a billet, the billet having a first grain structure, inductively heating the billet at an inductive heat treat temperature above a gamma prime solvus temperature of the alloy and subjecting the billet to a subsolvus heat treat temperature that is below the gamma prime solvus temperature of the alloy, waiting a period of time for the first grain structure in an outer portion of the billet to transform into a second grain structure that is coarser than the first grain structure, after the steps of inductively heating and subjecting the billet to the subsolvus heat treat temperature. The methods also include dividing the billet into at least two sections, and machining a final shape into one or more of the at least two sections to form the dual microstructure component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.