Injection compression molding system and method
US9216526B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 30, 2014 |
| Grant date | Dec 22, 2015 |
| Priority date | — |
| Expiry date | Oct 30, 2034 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2031/772
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
An injection compression molding system includes a mold having a fixed first half and a displaceable second half. The second half is initially positioned with a cavity between the mold halves having a first clearance sized to receive a molten material puddle shot injected by an injection molding device without the puddle shot filling the cavity. A displacement device acts during or immediately after puddle shot injection, displacing the second mold half toward the first mold half creating a second clearance less than the first clearance. The second clearance defines a finished part thickness whereby displacement of the second mold half to the second clearance compresses the puddle shot so that the puddle shot fills the cavity and forms a finished part between the mold halves. Total time to inject and compress the puddle shot is less than or equal to 1.0 seconds.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.