Patent · US Active

Encapsulated windshield molding

US9216635B2 · kind B2 · utility

2Cited by
14References
16Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMar 13, 2013
Grant dateDec 22, 2015
Priority date
Expiry dateMar 13, 2033

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB60J1/004
  • WIPO fieldTransport
  • WIPO sectorMechanical engineering

Abstract

An encapsulated windshield molding surrounds at least a portion of the peripheral edge of the windshield and includes one or more seals, such as multiple lip or whisker-type seals. The encapsulated molding aims to provide a water-tight installation of the windshield into the windshield opening of the vehicle and allows for butyl-free or adhesive-free restraint of the windshield.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.