Polymeric formulations with chemically adjustable rheology for the manufacture of prepregs and articles made of composite material
US9217082B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 29, 2012 |
| Grant date | Dec 22, 2015 |
| Priority date | — |
| Expiry date | Aug 4, 2032 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G18/8061
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A polymeric formulation comprising at least one first epoxy resin having a density between 100 and 10,000 Pa·s, a blocked isocyanate, a polymer comprising hydroxy functional groups, a thermoplastic resin and a cross-linking agent, the polymer comprising hydroxyl functional groups with a hydroxyl content in the range 0.65 to 0.95 meq/g, the isocyanate-equivalents-to-polymer-OH-equivalents rate being in the range 0.60 to 1.1. The first epoxy resin is substantially semisolid at room temperature, the formulation comprising at least one second epoxy resin substantially liquid at room temperature, the first and second epoxy resins being present in a weight ratio from 60:40 to 80:20. These formulations are advantageously used for manufacturing prepregs and articles of composite material according to a dry winding process. By virtue of improved stability, a higher glass transition temperature, and a rheological profile result which can be chemically tailored to the needs of the impregnation/dry winding process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.