Sensor mounting arrangement
US9217355B2 · kind B2 · utility
7Cited by
23References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 12, 2011 |
| Grant date | Dec 22, 2015 |
| Priority date | — |
| Expiry date | Oct 19, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02A50/20
- WIPO fieldEnvironmental technology
- WIPO sectorChemistry
Abstract
An arrangement for mounting at least one electrical component to a portion of an aftertreatment module, the arrangement including; at least one standoff member coupled between the electrical component and the portion of the aftertreatment module, and an enclosure substantially surrounding at least three sides of the electrical component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.