Patent · US Active

Sensor mounting arrangement

US9217355B2 · kind B2 · utility

7Cited by
23References
10Claims
0Family size

Assignee

Inventors

Key dates

Filing dateDec 12, 2011
Grant dateDec 22, 2015
Priority date
Expiry dateOct 19, 2034

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY02A50/20
  • WIPO fieldEnvironmental technology
  • WIPO sectorChemistry

Abstract

An arrangement for mounting at least one electrical component to a portion of an aftertreatment module, the arrangement including; at least one standoff member coupled between the electrical component and the portion of the aftertreatment module, and an enclosure substantially surrounding at least three sides of the electrical component.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.