Aerogel dielectric layer
US9218989B2 · kind B2 · utility
1Cited by
11References
23Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Sep 23, 2011 |
| Grant date | Dec 22, 2015 |
| Priority date | — |
| Expiry date | May 11, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A circuit board assembly includes a circuit board, a chip attached to the circuit board and a dielectric layer. The chip has a circuit facing the circuit board and spaced from it. The dielectric layer includes an aerogel. In one embodiment, the aerogel has a dielectric constant of approximately 2.0 or less and a compression strength of at least approximately 100 psi.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.