Method of manufacturing electric wiring layer, member for forming electric wiring layer, electric wiring layer, method of manufacturing electric wiring board, member for forming electric wiring board, electric wiring board, vibrator, electronic apparatus, and moving object
US9219218B2 · kind B2 · utility
3Cited by
2References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 22, 2014 |
| Grant date | Dec 22, 2015 |
| Priority date | — |
| Expiry date | Dec 22, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/252
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A method of manufacturing an electric wiring layer including an electric wiring includes obtaining a pressed powder molded layer by pressurizing a powder including a metal particle with an insulating layer, the metal particle being constituted by a metal particle having conductivity and a surface insulating layer which is located on a surface of the metal particle and which mainly contains a glass material; and irradiating the pressed powder molded layer with energy rays and forming the electric wiring in an irradiation region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.