Electronic component, electronic module, their manufacturing methods, mounting member, and electronic apparatus
US9220172B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 24, 2013 |
| Grant date | Dec 22, 2015 |
| Priority date | — |
| Expiry date | Jun 25, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49117
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing an electronic component includes a first step of preparing a mounting member formed by bonding a peripheral region of a base body having an outer terminal connected with a wiring member, and a frame body, while heating the base body and the frame body; a second step of fixing the electronic device to the base body; and a third step of bonding the lid body and the frame body. A condition αL, αF, αB<αC is satisfied, where αL is a thermal expansion coefficient of the lid body, αF is a thermal expansion coefficient of the frame body, αB is a thermal expansion coefficient of the base body, and αC is a thermal expansion coefficient of the wiring member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.