Semiconductor module cooler and semiconductor module
US9220182B2 · kind B2 · utility
3Cited by
3References
29Claims
0Family size
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Key dates
| Filing date | Dec 13, 2013 |
| Grant date | Dec 22, 2015 |
| Priority date | — |
| Expiry date | Feb 3, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/13055
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A semiconductor module cooler includes a fin which is a heat sink, which is thermally connected to a semiconductor element, and which has one or more notches in an edge at one or more arbitrary positions in a longitudinal direction and one or more convex ribs which are formed on a bottom of a water jacket having a cooling flow path and which fit into the one or more notches at one or more arbitrary positions. By doing so, the efficiency of transferring heat generated by the semiconductor element by a coolant is improved and cooling performance is improved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.