Seed panel
US9220190B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 23, 2014 |
| Grant date | Dec 29, 2015 |
| Priority date | — |
| Expiry date | Jun 23, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1052
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A composite article comprises a substrate element with a first cover element spaced from the substrate element. A second cover element is disposed between the first cover element and the substrate element. A first adhesive layer is disposed between the first and second cover elements, where the first adhesive layer is configured to adhere the first cover element to the second cover element. A second adhesive layer is disposed between the second cover element and the substrate element, where the second adhesive layer is configured to adhere the second cover element to the substrate element. At least one seed abuts the first adhesive layer. The first cover layer is configured to be separated from the first adhesive layer thereby exposing at least a portion of the seed(s). Also disclosed are a method of forming a composite article, and a method of planting a seed with a composite article.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.