Solder alloy, solder paste, and electronic circuit board
US9221132B2 · kind B2 · utility
52Cited by
0References
11Claims
0Family size
Assignee
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Key dates
| Filing date | Nov 16, 2012 |
| Grant date | Dec 29, 2015 |
| Priority date | — |
| Expiry date | Nov 16, 2032 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K35/22
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A solder alloy is a tin-silver-copper solder alloy containing tin, silver, copper, nickel, antimony, bismuth, and indium, and substantially does not contain germanium, wherein relative to the total amount of the solder alloy, the silver content is more than 0.05 mass % and less than 0.2 mass %, and the antimony content is 0.01 mass % or more and less than 2.5 mass %.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.