Heat/vacuum molding system for footwear
US9221211B2 · kind B2 · utility
3Cited by
24References
13Claims
0Family size
Inventor
Key dates
| Filing date | May 24, 2012 |
| Grant date | Dec 29, 2015 |
| Priority date | — |
| Expiry date | Jan 6, 2034 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C51/421
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A heat/vacuum molding system for molding a ski boot to a user's foot is provided. The system includes a heat source to heat an outer shell of the ski boot, a pliable plastic receptacle to receive the ski boot after the outer shell is heated by the heat source, and a vacuum system attached to the pliable plastic receptacle to create a negative pressure inside the pliable plastic receptacle to thereby collapse the pliable plastic receptacle to mold the ski boot to the user's foot.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.