Reinforced polyamide moulding materials
US9221974B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 8, 2006 |
| Grant date | Dec 29, 2015 |
| Priority date | — |
| Expiry date | Jul 18, 2028 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2666/20
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention relates to reinforced polyamide molding materials which can be prepared from a polyamide blend and, for example, by compounding with cut fibers or continuous filaments on twin-screw extruders and have mechanical properties which are usually not compatible with one another, namely a combination of exceptionally high rigidity and strength and at the same time good toughness. Furthermore, a high heat distortion temperature (HDT) is achieved according to the invention.The thermoplastic polyamide molding materials according to the invention are suitable for the production of moldings or other semifinished products or finished articles, which can be produced, for example, by extrusion, injection molding, direct methods or direct compounding, in which the compounded polyamide molding material is processed directly by injection molding, or other deformation techniques.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.