Conductive paste and printed wiring board
US9221980B2 · kind B2 · utility
0Cited by
2References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 19, 2015 |
| Grant date | Dec 29, 2015 |
| Priority date | — |
| Expiry date | Mar 19, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0769
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A conductive paste which can form a silver layer and a printed wiring board having a silver layer formed of the conductive paste. The conductive paste has silver particles and a migration inhibitor, which is present in the amount of 12 parts by mass to 40 parts by mass based on 100 parts by mass of the silver particles and represented by Formula (1):
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.