Method and system for galvanizing by plasma evaporation
US9222162B2 · kind B2 · utility
0Cited by
8References
10Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 7, 2008 |
| Grant date | Dec 29, 2015 |
| Priority date | — |
| Expiry date | May 2, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/334
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The invention relates to a method and a system for the plasma treatment of successive substrates comprising one or more steel products in which the substrates are transported, one after another, through at least one plasma treatment zone, characterized in that the electric power for generating the plasma in the treatment zone is varied according to the area of the substrate is present in this treatment zone when the substrate is running through this zone.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.