Suspension with spring bias acting on conductive adhesive bond for improved reliability
US9224408B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 11, 2015 |
| Grant date | Dec 29, 2015 |
| Priority date | — |
| Expiry date | Aug 11, 2035 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B5/4826
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In an electrical connection to an electrical component in a disk drive suspension, an electrical lead is adhered to a component using conductive adhesive and is also mechanically pressed up against the component using a bias mechanism. The bias mechanism may be a spring finger that is welded to the suspension, or it may be a stainless steel finger that is formed integrally with the trace gimbal assembly. The resulting bias force that presses the contact against the component surface reduces the small failure rate that can occur when the conductive adhesive separates from the component's surface as a result of stress such as induced by thermal cycling.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.