Method for eliminating contact bridge in contact hole process
US9224589B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 28, 2011 |
| Grant date | Dec 29, 2015 |
| Priority date | — |
| Expiry date | Sep 21, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/76837
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method for eliminating contact bridge in a contact hole process is disclosed, wherein a cleaning menu comprising a multi-step adaptive protective thin film deposition process is provided, so that a stack adaptive protective thin film is formed on the sidewall of the chamber of the HDP CVD equipment. The stack adaptive protective thin film has good adhesivity, compactness and uniformity to protect the sidewall of the chamber of the HDP CVD equipment from being damaged by the plasma, and avoid the generation of defect particles, thereby improving the HDP CVD technical yield and eliminating the contact bridge phenomenon in the contact hole process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.