Method for packaging quad flat non-leaded package body, and package body
US9224620B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 25, 2014 |
| Grant date | Dec 29, 2015 |
| Priority date | — |
| Expiry date | Mar 25, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/12042
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for packaging a quad flat non-leaded (QFN) package body. The method includes: etching an upper surface of a metal plate to process a groove to form a bond wire bench, a component bench, and a bump; processing the bump to a preset height, and assembling a component on the component bench; packaging the processed metal plate to form a package body, and exposing the surface of the processed bump on an upper surface of the package body to form a top lead; and etching a lower surface of the package body to process a bottom lead. In the present invention, large passive components can be stacked on the QFN package body with a top lead; the structure is simplified while the reliability of the welding joints is improved; a plurality of components can be stacked through the top lead to overcome the limitations of component stacking.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.