Patent · US Active

Encapsulation process and associated device

US9224621B2 · kind B2 · utility

0Cited by

6References

8Claims

0Family size

Assignee

COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES · FR

Inventors

Tony Maindron · Grenoble, FR
Nicolas Troc · Troyes, FR

Key dates

Filing date	Mar 18, 2014
Grant date	Dec 29, 2015
Priority date	—
Expiry date	Mar 18, 2034

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY02P70/50
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

The invention relates to an encapsulation process for an electronic component (2). The component (2) is connected to an electrical contact track composed of a metal layer (101).The process according to the invention comprises the following steps: The process according to the invention enables electrical contact through the encapsulation layer (4).The invention also relates to an electronic device obtained using such a process.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.