Semiconductor device, method of manufacturing the device, and liquid crystal display
US9224622B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 5, 2012 |
| Grant date | Dec 29, 2015 |
| Priority date | — |
| Expiry date | Apr 10, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/13091
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In order to shield the light incident from the chip side surface or chip rear surface of a semiconductor chip that forms an LCD driver, a light-shielding film is formed over the chip side surface and chip rear surface of the semiconductor chip itself, not using a light-shielding tape that is a component separate from the semiconductor chip. Accordingly, the light-shielding tape as a separate component is not used, and hence the trouble that the light-shielding tape may protrude from the surface of a glass substrate whose thickness has been made small can be solved. As a result, the thinning of a liquid crystal display, and the subsequent thinning of the mobile phone in which the liquid crystal display is mounted can be promoted.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.