Method for non-planar chip assembly
US9224716B2 · kind B2 · utility
1Cited by
20References
5Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 19, 2013 |
| Grant date | Dec 29, 2015 |
| Priority date | — |
| Expiry date | Nov 19, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
Methods and apparatuses for assembly of a non-planar device based on curved chips are described. Slots may be created as longitudinal openings in the chips to reduce bending stresses to increase allowable degrees of deformation of the chips. The chips may be deformed to a desired deformation within the allowable degrees of deformation via the slots. Holding constraints may be provided on at least a portion of the chips to allow the chips to remain curved according the desired deformation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.