Ruggedized low-relection/high-transmission integrated spindle for parallel-plate transmission-line structures
US9225052B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 29, 2013 |
| Grant date | Dec 29, 2015 |
| Priority date | — |
| Expiry date | Aug 29, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01P1/162
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A radio frequency (RF) transmission-line structure includes a parallel-plate transmission line formed from a first conducting plate and a second conducting plate. The second conducting plate is spaced apart from the first conducting plate and substantially parallel to the first conducting plate. A support member is attached to the first and second plates and is operative to maintain a fixed mechanical spacing between the first conducting plate and the second conducting plate. The transmission-line structure further includes at least one feature configured to isolate or suppress RF interaction of the support member with RF fields within the parallel-plate transmission line.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.