Apparatus and method for embedding components in small-form-factor, system-on-packages
US9225379B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 31, 2014 |
| Grant date | Dec 29, 2015 |
| Priority date | — |
| Expiry date | Jul 31, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/066
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
According to various aspects of the present disclosure, devices and methods are disclosed that include communication platform including a small form factor platform having a system-on-package architecture. The system-on-package architecture may be arranged as a stack of layers including: a first layer of the stack of layers having a first conformable material; a second layer of the stack of layers having a second conformable material; a third layer of the stack of layers having a third material, wherein the first conformable material and the second conformable material are more flexible than the third material; and one or more electronic components embedded within the stack of layers, wherein the one or more electronic components are configured to process a received wireless signal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.